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MCP2122T-E/SN by microchip technology
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MCP2122T-E/SN

Microchip Technology

Infrared Encoder/Decoder - 115.2KBd - 8-Pin SOIC N - Tape&Reel .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP2122T-E/SN
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
3300
Tipo de encapsulado:
REEL
Tensión de alimentación de funcionamiento máxima:
5.5 V
Velocidad de datos máxima:
115.2 KBd
Dimensión:
4.9 x 3.9 x 1.25(Min) mm
Familia:
MCP2122
Tensión mínima de alimentación de funcionamiento:
1.8 V
Categoría:
Infrared Encoder/Decoder
Montaje:
Surface Mount
The MCP2122T-E/SN is an infrared encoder/decoder module designed for easy integration into various applications. It operates at a high baud rate of 115.2KBd and features an 8-pin SOIC N package. This module is supplied in Tape&Reel packaging, ensuring efficient handling and storage. With its reliable infrared encoding and decoding capabilities, the MCP2122T-E/SN is an excellent choice for projects requiring seamless wireless communication.
Palabras clave de búsqueda:
MCP2122TESN
EN STOCK: 4.950
Puede enviar inmediatamente
Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$0.976
$244.000
500
$0.967
$483.500
1.000
$0.960
$960.000
3.300
$0.955
$3,151.500
6.600
$0.953
$6,289.800
9.900
$0.951
$9,414.900
13.200
$0.948
$12,513.600
16.500 +
$0.946
$15,609.000
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF Product Change Notification

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