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MCP23017-E/ML by microchip technology
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FICHA TÉCNICA

MCP23017-E/ML

Microchip Technology

I/O Expander - 16bit - 1.7MHz - I2C - 1.8 to 5.5 V - QFN - 28-Pin. .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP23017-E/ML
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
61
Tipo de paquete:
TUBE
I2C Bus Interface Mode:
Fast Mode Plus
Family:
MCP23017
Interface Type:
I²C
Manual Reset:
Yes
Interrupt Output:
Yes
Interface Speed:
1700 kHz
Maximum Operating Supply Voltage:
5.5 V
Dimension:
6 x 6 x 0.88 mm
The MCP23017/MCP23S17 (MCP23X17) device family provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications. The MCP23X17 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits (IODIRA/B). The data for each input or output is kept in the corresponding input or output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master.
Palabras clave de búsqueda:
MCP23017EML
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EN STOCK: 2.170
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Cantidad mínima de pedido:
61
Múltiple:
61
Plazo de entrega de fábrica
7 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
61
$1.46
$89.06
305
$1.41
$430.05
549
$1.39
$763.11
1.037
$1.38
$1,431.06
2.501
$1.37
$3,426.37
5.002
$1.36
$6,802.72
7.503
$1.35
$10,129.05
10.004 +
$1.34
$13,405.36
Suppliers Standard Package
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 16-Jan-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 150K AND 160 TECHNOLOGY
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of 28L QFN (6x6) package at ASAC (UTAC) assembly site in o
PDF PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X
PDF PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a
PDF PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 24-May-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 10-Sep-2008 - QUALIFICATION OF 28L QFN (6X6X0.9MM) PACKAGE AT ASAT LIMITED, CHINA (ASAC) ASSEMBLY
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 22-Jul-2008 - Microchip is announcing the qualification of UTAC THAI LIMITED (UTL) as a new test site for 28QFN (6
PDF PCN - 20-Apr-2011 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION
PDF PCN - 01-Jul-2022 - DOCUMENT CHANGE
PDF PCN - 27-Mar-2009 - Microchip is cancelling the previously announced CCB#848 as the current production demand for 28L QF
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 22-Jul-2008 - QUALIFICATION OF UTAC THAI LIMITED (UTL) TO TEST 28QFN (6X6) PACKAGED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 21-Jul-2008 - Microchip is announcing the qualification of 28L QFN package (6X6X0.9mm) at ATP Assembly in order to
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 21-Jul-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9 MM) AT ATP ASSEMBLY
PDF PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE
PDF PCN - 11-Nov-2004 -
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 10-Sep-2008 - Microchip is announcing the qualification of new assembly site for 28L QFN (6X6X0.9MM) package dsPIC
PDF PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY
PDF PCN - 27-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGY
PDF PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 26-Apr-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 08-Mar-2007 -
PDF PCN - 10-Sep-2008 - NEW ASSEMBLY SITE
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 27-Mar-2009 - PCN CCB#848 CANCELLED
PDF PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo
PDF PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE
PDF PCN - 27-Oct-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9MM) AT ATP ASSEMBLY
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (
PDF PCN - 24-Nov-2008 - Qualification Of 28L Qfn Package (6X6X0.9Mm) At Atp Assembly
PDF PCN - 01-Sep-2008 - Qualification Of 28L Qfn Package (6X6X0.9 Mm) At Atp Assembly
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 30-Jan-2011 - Qualification Of 28L Qfn (6X6) Package At Asac (Utac) Assembly Site.
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 31-Oct-2008 - Qualification Of 28L Qfn (6X6X0.9Mm) Package At Asat Limited, China (Asac) Assembly
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 30-Sep-2008 - Qualification Of Utac Thai Limited (Utl) To Test 28Qfn (6X6) Packaged Products
PDF Product Change Notification

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