MCP23017-E/SP by microchip technology
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MCP23017-E/SP

Microchip Technology

I/O Expander - 16bit - 1.7MHz - I2C - 1.8 to 5.5 V - SPDIP - 28-Pin. .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP23017-E/SP
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
15
Tipo de encapsulado:
TUBE
Tipo de Interfaz:
I²C
Velocidad de Interfaz:
1700 kHz
Modo de Interfaz del Bus I2C:
Standard Mode
Reset Manual:
Yes
Salida de Interrupción:
Yes
Familia:
MCP23017
Tensión de alimentación de funcionamiento máxima:
5.5 V
Dimensión:
34.67 x 7.24 x 3.43 mm
The MCP23017-E/SP consists of multiple 8 bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits (IODIRA/B). The data for each input or output is kept in the corresponding input or output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master.
Palabras clave de búsqueda:
MCP23017ESP
EN STOCK: 2.065
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Cantidad mínima de pedido:
15
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
15
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
15
$1.72
$25.80
105
$1.28
$134.40
255
$1.26
$321.30
510
$1.25
$637.50
1.005
$1.24
$1,246.20
2.505
$1.23
$3,081.15
5.010
$1.22
$6,112.20
7.500 +
$1.21
$9,075.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 11-Nov-2004 -
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 18-Sep-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 26-Dec-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 25-May-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 08-Nov-2010 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 24-Aug-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 26-Dec-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 23-Aug-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 26-Dec-2013 - Microchip is announcing the qualification of palladium coated copper (PdCu) bond wire at MMT (ALPH)
PDF PCN - 26-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 08-Mar-2007 -
PDF PCN - 09-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 01-Jul-2022 - DOCUMENT CHANGE
PDF PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 25-May-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 18-Dec-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 06-Feb-2014 - Microchip is announcing the qualification of selected products available in the 28L SPDIP, 8L PDIP,
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 18-Sep-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 23-Aug-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 8L PDIP
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Aug-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 26-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 18-Dec-2013 - Microchip is announcing the qualification of the listed products in the 28L SPDIP, 8L PDIP, and 18L
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 18-Sep-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 18L PDI
PDF PCN - 13-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL
PDF PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

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