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MCP23S08-E/SS by microchip technology
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FICHA TÉCNICA

MCP23S08-E/SS

Microchip Technology

I/O Expander - 8bit - 10 MHz - SPI - 1.8 to 5.5 V - SSOP - 20-Pin. .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Proveedor:
Microchip Technology
Nº de pieza:
MCP23S08-E/SS
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
67
Tipo de paquete:
TUBE
Salida de Interrupción:
Yes
Velocidad de Interfaz:
10000 kHz
Reset Manual:
Yes
Familia:
MCP23S08
Tipo de Interfaz:
SPI
Modo de Interfaz del Bus I2C:
N/R
Tensión de alimentación de funcionamiento máxima:
5.5 V
Dimensión:
7.2 x 5.3 x 1.75 mm
The MCP23S08-E/SS is a 8-bit general purpose, parallel I/O Expansion for SPI applications. The MCP23S08 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding input or output register. The polarity of the input port register can be inverted with the polarity inversion register. All registers can be read by the system master.
Palabras clave de búsqueda:
MCP23S08ESS
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Cantidad mínima de pedido:
67
Múltiple:
67
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
67
$1.29
$86.43
268
$1.15
$308.20
536
$1.14
$611.04
1.005
$1.13
$1,135.65
2.546
$1.12
$2,851.52
5.025
$1.11
$5,577.75
7.504
$1.10
$8,254.40
10.050 +
$1.09
$10,954.50
Embalaje estándar del proveedor
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co
PDF PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at
PDF PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE AT ANAP
PDF PCN - 14-Jul-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300
PDF PCN - 24-Mar-2017 - UPDATION- QUALIFICATION OF SILVER (AG)-ON-LEADS PLATED LEAD FRAME
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Mar-2007 -
PDF PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 08-Jun-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
PDF PCN - 15-Oct-2015 - QUALIFICATION OF AG RING PLATED LEAD-FRAME AND G700LS MOLD COMPOUND FOR 20L SSOP PACKAGE
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 12-Dec-2018 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 22-Mar-2017 - QUALIFICATION OF SILVER (AG)-ON-LEADS PLATED LEAD FRAME
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 14-Feb-2019 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K
PDF PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 24-Mar-2017 - UPDATION QUALIFICATION OF SILVER (AG)-ON-LEADS PLATED LEAD FRAME
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 08-Mar-2007 - Product Change Notice

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