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MCP25050-I/SL by microchip technology
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FICHA TÉCNICA

MCP25050-I/SL

Microchip Technology

CanBus I/O Expander - 1Mbps - Sleep - 3.3V/5V - 14-Pin SOIC N - Tube .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP25050-I/SL
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
57
Tipo de paquete:
TUBE
Dimensión:
8.65 x 3.9 x 1.25(Min) mm
Tensión de alimentación de funcionamiento máxima:
5.5 V
Familia:
MCP25050
Velocidad de datos máxima:
1 Mbps
Categoría:
Controller
The MCP25050-I/SL is a high-performance CanBus I/O Expander designed to provide efficient control and expansion capabilities for automotive and industrial applications. With a data rate of up to 1Mbps, this device enables seamless communication and connectivity between different nodes in a network. Featuring a sleep mode, it provides power-saving functionality, making it ideal for applications with limited power resources. Operating at both 3.3V and 5V, this 14-Pin SOIC N packaged device offers versatile compatibility options. Packaged in a tube presentation, it ensures easy handling and storage.
Palabras clave de búsqueda:
MCP25050ISL
EN STOCK: 711
Puede enviar inmediatamente
Cantidad mínima de pedido:
57
Múltiple:
57
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
57
$4.01
$228.57
114
$3.85
$438.90
285
$3.80
$1,083.00
513
$3.79
$1,944.27
1.026
$3.78
$3,878.28
2.508
$3.77
$9,455.16
5.016 +
$3.76
$18,860.16
Embalaje estándar del proveedor
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Oct-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 01-Jun-2005 - Qualification Of 14L Soic Etched Leadframe With 98X235 Paddle At Mtai
PDF PCN - 19-Apr-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

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