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MCP25050-I/SL by microchip technology
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MCP25050-I/SL

Microchip Technology

CanBus I/O Expander - 1Mbps - Sleep - 3.3V/5V - 14-Pin SOIC N - Tube .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP25050-I/SL
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
57
Tipo de encapsulado:
TUBE
Dimensión:
8.65 x 3.9 x 1.25(Min) mm
Tensión de alimentación de funcionamiento máxima:
5.5 V
Familia:
MCP25050
Velocidad de datos máxima:
1 Mbps
Categoría:
Controller
The MCP25050-I/SL is a high-performance CanBus I/O Expander designed to provide efficient control and expansion capabilities for automotive and industrial applications. With a data rate of up to 1Mbps, this device enables seamless communication and connectivity between different nodes in a network. Featuring a sleep mode, it provides power-saving functionality, making it ideal for applications with limited power resources. Operating at both 3.3V and 5V, this 14-Pin SOIC N packaged device offers versatile compatibility options. Packaged in a tube presentation, it ensures easy handling and storage.
Palabras clave de búsqueda:
MCP25050ISL
EN STOCK: 711
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
57
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
57
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
57
$3.58
$204.06
114
$3.51
$400.14
285
$3.47
$988.95
513
$3.41
$1,749.33
1.026
$3.40
$3,488.40
2.508
$3.39
$8,502.12
5.016
$3.38
$16,954.08
7.524 +
$3.37
$25,355.88
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Oct-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 01-Jun-2005 - Qualification Of 14L Soic Etched Leadframe With 98X235 Paddle At Mtai
PDF PCN - 19-Apr-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

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