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MCP3001T-I/SN by microchip technology
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MCP3001T-I/SN

Microchip Technology

Single Channel ADC - SAR - 200ksps - 10-bit Serial - Automotive - 8-Pin SOIC N - Tape&Reel .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP3001T-I/SN
RoHS:
Yes
HTS:
8542390030
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
3300
Tipo de encapsulado:
REEL
Tipo de convertidor:
General Purpose
No Linealidad Diferencial:
±1 LSB
Soporte de Alimentación Digital:
No
Arquitectura:
SAR
Entrada Diferencial:
Yes
Tipo de Interfaz Digital:
Serial (3-Wire, SPI)
The MICROCHIP TECH. MCP3001T-I/SN is a single channel ADC (Analog-to-Digital Converter) designed for automotive applications. It utilizes the Successive Approximation Register (SAR) architecture and offers a sampling rate of 200,000 samples per second. With a resolution of 10 bits, this ADC provides accurate and precise conversion of analog signals to digital data. The MCP3001T-I/SN operates in a serial communication mode and is housed in an 8-pin Small Outline Integrated Circuit (SOIC) package. It is supplied in Tape & Reel packaging, making it suitable for automated assembly processes.
Palabras clave de búsqueda:
MCP3001TISN
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 6.096
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$1.69
$422.50
500
$1.66
$830.00
1.000
$1.64
$1,640.00
3.300
$1.62
$5,346.00
6.600
$1.61
$10,626.00
9.900
$1.60
$15,840.00
13.200
$1.59
$20,988.00
16.500 +
$1.58
$26,070.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

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