help desk software
MCP6022-I/SN by microchip technology
Imagen de referencia - consulte las especificaciones del fabricante
FICHA TÉCNICA

MCP6022-I/SN

Microchip Technology

Operational Amplifier - Dual - 2 Amplifier - 10 MHz - 7 V/µs - 2.5V to 5.5V - 8 Pins. .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
Atributo del producto
Valor del atributo Seleccionar atributo
Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP6022-I/SN
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
100
Tipo de encapsulado:
TUBE
Dimensión:
4.9 x 3.9 x 1.25(Min) mm
The MCP6022 dual operational amplifier (op amp) has a gain bandwidth product of 10 MHz with a low typical operating current of 1.0 mA and an offset voltage that is less than 0.5 mV. The MCP6022 uses Microchip's advanced CMOS technology, which provides low bias current, high-speed operation, high open-loop gain, and rail-to-rail output swing. The MCP6022 operates with a single supply voltage that can be as low as 2.5V, while drawing less than 1.35 mA of quiescent current per amplifier. The MCP6022 is available in standard 8-lead PDIP, SOIC and TSSOP packages. This amplifier is ideal for battery and loop-powered applications as well as industrial process control, low-power battery-operated devices, portable equipment, data acquisition equipment, test equipment and low-end audio applications. AEC-Q100 Grade 1 qualification is available for this device.
Palabras clave de búsqueda:
MCP6022ISN
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 1.800
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
100
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
100
Plazo de entrega de fábrica
21 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
100
$1.47
$147.00
300
$1.45
$435.00
500
$1.43
$715.00
1.000
$1.42
$1,420.00
2.500
$1.41
$3,525.00
5.000
$1.40
$7,000.00
7.500
$1.39
$10,425.00
10.000 +
$1.38
$13,800.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 03-Jun-2004 - QUALIFY AMKOR SHANGHAI, CHINA (ATC) FOR 8L SOIC PACKAGE
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150
PDF PCN - 28-Jun-2005 - Product Change Notice
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

© 2026 ECCO GROUP ECIA