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MCP617T-I/SN by microchip technology
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FICHA TÉCNICA

MCP617T-I/SN

Microchip Technology

Dual Op-Amp - 2.3 to 5.5V - 25uA - Rail to Rail Output - -40°C to +85°C - 8-Lead SOIC .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Proveedor:
Microchip Technology
Nº de pieza:
MCP617T-I/SN
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
3300
Tipo de paquete:
REEL
The MCP617T-I/SN is a high-performance dual op-amp designed for a wide range of applications. Operating on a low voltage range of 2.3 to 5.5V, this op-amp offers a low quiescent current of 25uA, making it ideal for battery-powered devices. With rail-to-rail output capability, it provides maximum dynamic range and flexibility. The op-amp is designed to operate in a temperature range of -40°C to +85°C, ensuring reliable performance in various environmental conditions. Housed in an 8-Lead SOIC package, the MCP617T-I/SN is a compact and versatile solution for precision amplifier applications.
Palabras clave de búsqueda:
MCP617TISN
EN STOCK: 2.976
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Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
250
$0.872
$218.000
500
$0.867
$433.500
1.000
$0.846
$846.000
3.300
$0.831
$2,742.300
6.600
$0.827
$5,458.200
9.900
$0.825
$8,167.500
13.200
$0.822
$10,850.400
16.500 +
$0.820
$13,530.000
Suppliers Standard Package
Guías de productos
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Product Changes
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 22-Jan-2004 - QUALIFY MTAI ASSEMBLY FOR LARGE PADDLES (82X94 MILS AND 84X105.6 MILS)
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY
PDF PCN - 22-Jan-2004 - Product Change Notice

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