PIC18F2580-I/SO by microchip technology
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PIC18F2580-I/SO

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 4.2 V to 5.5 V - Pins: 28 - Package type: SOIC 28– Speed 40 MHz - Flash 32 kB – SRAM 1536 Bytes – EEPROM 256 Bytes - I/O: 25 – A/D: 10 bit with 08 channels – 04 Timers – MSSP – CAN .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
PIC18F2580-I/SO
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
27
Tipo de encapsulado:
TUBE
Tamaño de la RAM:
1.5 KB
Número de I/Os Programables:
22
Tipo de Memoria de Programa:
Flash
Resolución ADC:
10 bit
Temperatura de Funcionamiento:
-40 to 85 °C
Tamaño de la memoria de programa:
32 KB
The MICROCHIP TECH PIC18F2580-I/SO is part of PIC18 family with a 8-Bit RISC microcontroller. It can sustain standard temperature ranges from -40°C to + 125 C, has 28 pin in SOIC-28 package and 40 MHz clock speed. This device has a Flash memory of 32 KB, a SRAM of 1536 bytes, EEPROM of 256 bytes, four timers module and 08 channels of 10 bits ADC. This MCU includes MSSP & EUSART communication modules (I2C & SPI modules) with 25 I/O pins. It can be used to achieve various tasks.
Palabras clave de búsqueda:
PIC18F2580ISO
EN STOCK: 305
Puede enviar inmediatamente
Cantidad mínima de pedido:
27
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
27
Plazo de entrega de fábrica
10 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
27
$7.99
$215.73
54
$7.92
$427.68
108
$7.86
$848.88
270
$7.82
$2,111.40
513
$7.80
$4,001.40
1.026
$7.79
$7,992.54
2.511 +
$7.77
$19,510.47
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 12-Jul-2006 - Qualification Of 28L Qfns (6X6Mm) At Nseb Assembly, Thailand
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 17-Nov-2009 - Microchip Has Released A New Devicedoc For The Pic18F2480/2580/4480/4580 Data Sheet Of Devices.
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 23-Feb-2010 - Errata - Pic18F2480/2580/4480/4580 Silicon/Data Sheet Errata
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 17-Nov-2009 - Released A New Devicedoc
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Mar-2010 - Errata-Pic18F2480/2580/4480/4580 Silicon/Data Sheet Errata
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

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