The 98464-G61-14ULF is a Minitek® unshrouded header connector designed for pin-in-paste (PiP) soldering processes, enabling integration of board-to-board connectors in SMT manufacturing workflows. This connector features a 2.00mm pitch and is optimized for automatic or manual placement on PCBs followed by reflow soldering in a single operation. The product utilizes gold plating on the contact area (0.76µm/30µin.) with tin plating on the solder side (2–6µm/50–150µin.), ensuring reliable electrical connections and solderability. The connector is compatible with standard stencil apertures requiring a hole diameter of 0.85mm ± 0.05mm for optimal solder paste deposit. Pin-in-paste technology allows these connectors to maintain mechanical strength comparable to traditional through-hole soldering while benefiting from the efficiency and automation of SMT processes. This solution is ideal for applications requiring compact board-to-board interconnections in high-volume manufacturing environments.