V5583K is an aluminum heat sink designed for thermal management of electronic components. Manufactured from AlMgSi 0.5 aluminum alloy with a black anodized surface finish and deburred edges, this component provides efficient heat dissipation with a thermal resistance of 3.3 K/W. The heat sink features multiple mounting options including M3 and M2.5 threaded holes, with key dimensions of 40.25 mm length, 10.15 mm width, and 2.5 mm thickness. The design includes angular tolerances of ±2° and 3° for precise alignment. This component is RoHS compliant and suitable for applications requiring reliable thermal management in compact electronic assemblies, industrial equipment, and consumer electronics where space constraints and heat dissipation efficiency are critical.