SF-1206F080-2
BournsFuse Chip Fast Acting 0.8A 63V SMD Solder Pad 1206 T/R UL .. Ver descripción completa
Atributo del producto
Valor del atributo
Seleccionar atributo
Productos Encontrados: 0
Proveedor:
Bourns
Nº de pieza:
SF-1206F080-2
RoHS:
Yes
HTS:
8536100040
COO:
TW
ECCN:
EAR99
Empaque estándar del proveedor
5000
Tipo de encapsulado:
REEL
Tipo:
Chip
Tamaño del fusible:
3.1 x 1.55 mm
Acción:
Fast
Corriente Nominal:
0.8 A
Tensión AC Máxima Nominal:
N/A
Tensión DC Máxima Nominal:
63 V
Material del Fusible:
N/A
Montaje:
Surface Mount
SF-1206F080-2 is a fast-acting thin film chip fuse designed for overcurrent protection in compact surface mount applications. It features a rated current of 0.80 A, a typical resistance of 211 mO, and a rated voltage of DC 63 V with a breaking capacity of 50 A. The fuse has a typical I²t value of 0.031 A²s and operates within a temperature range of -20°C to +105°C, with a temperature rise below 75°C at rated current. The 3216 (EIA 1206) miniature footprint enables automated assembly and is ideal for portable memory, LCD monitors, disk drives, cell phones, rechargeable battery packs, and industrial controllers where reliable overcurrent protection is essential.
Palabras clave de búsqueda:
SF1206F0802
EN STOCK:
3.500
Puede enviar inmediatamente
MOQ para Cantidad en Stock:
1250
MOQ para cantidad agotada:
1250
Plazo de entrega de fábrica
12 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
1.250
$0.2847
$355.8750
2.500
$0.2741
$685.2500
3.750
$0.2734
$1,025.2500
5.000
+
$0.2410
$1,205.0000
English
中文 / 汉语
Español
