SF-1206S050-2
BournsFuse Chip Slow Blow Acting 0.5A 63V SMD Solder Pad 1206 Ceramic T/R UL .. Ver descripción completa
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Productos Encontrados: 0
Proveedor:
Bourns
Nº de pieza:
SF-1206S050-2
RoHS:
Yes
HTS:
8536100040
COO:
TW
ECCN:
EAR99
Empaque estándar del proveedor
5000
Tipo de encapsulado:
REEL
Tipo:
Chip
Tamaño del fusible:
3.1 x 1.55 x 0.6mm
Acción:
Slow Blow
Corriente Nominal:
0.5 A
Tensión AC Máxima Nominal:
N/A
Tensión DC Máxima Nominal:
63 V
Material del Fusible:
Ceramic
Montaje:
Surface Mount
SF-1206S050-2 is a slow blow thin film chip fuse designed for overcurrent protection in electronic circuits. It features a rated current of 0.50 A, typical resistance of 596 mO, and a typical I²t value of 0.030 A²s. The fuse is housed in a compact 3216 (EIA 1206) miniature footprint suitable for surface mount automated assembly. It operates over a temperature range of -20°C to +105°C and is UL listed (UL 248-14), RoHS compliant, and halogen free. Common applications include portable memory devices, LCD monitors, digital cameras, cell phones, rechargeable battery packs, and industrial controllers.
Palabras clave de búsqueda:
SF1206S0502
EN STOCK:
7.581
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Cantidad mínima de pedido:
1250
Plazo de entrega de fábrica
12 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
1.250
$0.510
$637.500
2.500
$0.457
$1,142.500
3.750
$0.436
$1,635.000
5.000
$0.320
$1,600.000
10.000
$0.304
$3,040.000
15.000
+
$0.203
$3,045.000
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