SF-1206S250-2
BournsFuse Chip Slow Blow Acting 2.5A 32V SMD Solder Pad 1206 T/R UL .. Ver descripción completa
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Proveedor:
Bourns
Nº de pieza:
SF-1206S250-2
RoHS:
Yes
HTS:
8536100040
COO:
TW
ECCN:
EAR99
Embalaje estándar del proveedor
5000
Tipo de encapsulado:
REEL
Tipo:
Chip
Tamaño del fusible:
3.1 x 1.55 x 0.6mm
Acción:
Slow Blow
Corriente Nominal:
2.5 A
Tensión AC Máxima Nominal:
N/A
Tensión DC Máxima Nominal:
32 V
Material del Fusible:
N/A
Montaje:
Surface Mount
SF-1206S250-2 is a slow blow thin film chip fuse designed for overcurrent protection in compact surface mount applications. It features a rated current of 2.5 A with a typical resistance of 33 mO and an I²t value of 0.605 A²s, providing reliable protection with a fusing time within 5 seconds at 250% of rated current. The fuse is housed in a miniature 3216 (EIA 1206) footprint with ceramic substrate construction and Sn plating, suitable for automated assembly and reflow soldering at peak temperatures of 250°C. Operating over a temperature range of -20°C to +105°C, this UL-listed (UL 248-14), RoHS-compliant, and halogen-free fuse is ideal for portable electronics, battery chargers, LCD monitors, and industrial controllers where space constraints and reliable overcurrent protection are essential.
Palabras clave de búsqueda:
SF1206S2502
EN STOCK:
11.000
Puede enviar inmediatamente
Cantidad mínima de pedido:
1000
Plazo de entrega de fábrica
12 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
1.000
$0.2940
$294.0000
2.500
$0.2831
$707.7500
5.000
$0.2737
$1,368.5000
10.000
$0.2730
$2,730.0000
15.000
$0.2703
$4,054.5000
25.000
$0.2671
$6,677.5000
50.000
+
$0.2664
$13,320.0000
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