The Boyd Laconia LLC part 4949G is a high-performance Thermal Hardener Epoxy designed for effective heat dissipation in electronic components and circuit boards. With a superior Thermal Conductivity of 1.34W/m-K, this epoxy ensures efficient thermal management, preventing overheating and enhancing overall system reliability. Each package contains a generous 25 grams of the epoxy, providing ample coverage for multiple applications. With a lengthy 12 months Shelf Life, the epoxy remains stable and usable for an extended duration, ensuring consistent performance when needed. Trust Boyd Laconia LLC part 4949G for all your thermal management needs.