534202B02853G is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. The heat sink is constructed from aluminum with black anodize finishing and features a Kool Clip attachment mechanism for secure device mounting. Key dimensional specifications include a width of 25.40 mm, length of 12.70 mm, and height of 29.97 mm, with vertical mounting orientation and specific lead positioning dimensions (X: 11.18 mm, Y: 8.00 mm, Z: 2.39 mm). The product is RoHS compliant and designed for efficient thermal management in compact board-level applications where space constraints and reliable heat dissipation are critical requirements.