577202B04000G
Boyd Laconia LLCThe 577202B04000G is an aluminum, channel-style board level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. Ver descripción completa
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Productos Encontrados: 0
Proveedor:
Boyd Laconia LLC
Nº de pieza:
577202B04000G
Alias/alias:
041840
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Paquete estándar del proveedor
1
Tipo de paquete:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Screw6706
Dimension:
13.21 x 19.05 x 12.76714mm
Thermal Resistance:
24.46717°C/W
Finish:
Black Anodized6710
The 577202B04000G is a channel board level heat sink intended for the thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish, this heat sink has a length of 12.7 mm, a width of 13.21 mm, and a height of 19.05 mm. It requires a mounting kit for device attachment and offers versatile integration. Its design supports both horizontal and vertical mounting orientations, making it suitable for various board-level cooling applications where efficient heat dissipation is critical.
Palabras clave de búsqueda:
577202B04000G
EN STOCK:
5.078
Puede enviar inmediatamente
A la orden:
15.000
puede enviar 7/10/26
MOQ para Cantidad en Stock:
10
MOQ para cantidad agotada:
1250
Plazo de entrega de fábrica
9 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
10
$0.84
$8.40
250
$0.82
$205.00
500
$0.79
$395.00
1.250
$0.77
$962.50
2.500
$0.74
$1,850.00
3.750
$0.72
$2,700.00
5.000
+
$0.70
$3,500.00
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