578622B03200G is a twin channel board level heat sink designed to cool TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish, this heat sink features dimensions of 37.59 mm width, 12.70 mm length, and 25.40 mm height with vertical mounting orientation. The mechanical specifications include X dimension of 8.13 mm (0.320 in), XT dimension of 19.30 mm (0.760 in), Y dimension of 5.08 mm (0.200 in), and Z dimension of 1.91 mm (0.075 in). This RoHS compliant heat sink requires a mounting kit for device attachment and is ideal for board level thermal management applications in electronic systems.