590102B03600G
Boyd Laconia LLCHeat Sink Passive TO-220 Recessed Thru-Hole Aluminum 10A°C/W Black Anodized .. Ver descripción completa
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Proveedor:
Boyd Laconia LLC
Nº de pieza:
590102B03600G
Alias/alias:
043224
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Paquete estándar del proveedor
240
Tipo de paquete:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Solder Tab6706
Dimension:
25.4 x 25.4 x 42.546714mm
Thermal Resistance:
106717°C/W
Finish:
Black Anodized6710
The 590102B03600G is a Channel 5901 board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features dimensions of 25.40 mm width, 25.40 mm length, and 42.54 mm height, with a vertical mounting direction for optimal thermal performance. The device requires a mounting kit for attachment and is RoHS compliant, making it suitable for environmentally conscious applications. This heat sink is ideal for power management and thermal regulation in compact board-level cooling applications where space efficiency and reliable heat dissipation are critical.
Palabras clave de búsqueda:
590102B03600G
EN STOCK:
744
Puede enviar inmediatamente
MOQ para Cantidad en Stock:
5
MOQ para cantidad agotada:
540
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
5
$4.44
$22.20
100
$2.91
$291.00
250
$2.71
$677.50
540
$2.65
$1,431.00
1.080
$2.63
$2,840.40
1.620
$2.60
$4,212.00
2.160
+
$2.27
$4,903.20
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