The 2504026017Y0 is a multi-layer chip bead designed to suppress conducted EMI signals in compact electronic devices. It features a 0402 (1005) package size with a nominal impedance of 600O ±25% at 100 MHz, typical impedance of 400O at 50 MHz and 645O at 500 MHz, and a maximum DC resistance of 1.1O. The bead supports a maximum current rating of 50 mA and operates at standard signal speed, making it suitable for automated placement and dense circuit board packaging. Common applications include cellular phones, computers, laptops, and pagers, where space constraints and EMI mitigation are critical requirements.