The 63-0000-0977 is a VOC-free no-clean soldering flux formulated to reduce bottomside micro-soldering and bridging in wave soldering applications. It features a wetting system designed to allow for a larger process window and can serve longer dwell times in extremely turbulent chip waves, making it ideal for spray applications. With 3.25% solids content, a specific gravity of 1.012, and zero VOC emissions (0 g/liter), this flux meets Telcordia Issue 1 GR-78-CORE and IPC/J-STD-004B flux designator ORL0 specifications. The product is engineered to provide excellent hole-fill and consistent soldering results while minimizing flux residue. Residue removal, when required, can be accomplished by washing with hot de-ionized water at 49–60 °C (140–160 °F) or using a 1% solution of Kester's #5768 Bio-Kleen® saponifier, making it suitable for high-volume automated assembly operations.