The 832FX-1.7L is a black, flexible, two-part epoxy designed for encapsulating and potting printed circuit boards and electronic assemblies. This solvent-free epoxy features a very low mixed viscosity of 700 cP, good adhesion to a wide variety of substrates, and excellent electrical insulating characteristics. Once cured, it has a hardness of 88A, a tensile strength of 9.6 N/mm², and a service temperature range of -40 to 140 °C. It is ideal for applications where minimizing physical stress on components is critical, performing well in low-temperature environments or those involving rapid temperature cycling. This product is supplied as a 2-can kit with a total net volume of 1.7 liters.