24FC256-I/MS by microchip technology
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FICHA TÉCNICA

24FC256-I/MS

Microchip Technology

EEPROM - Serial-I²C - 256Kb (32K x 8) - 1MHz - 1.8V/2.5V/3.3V/5V - 8-Pin MSOP - Tube

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
24FC256-I/MS
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
100
Tipo de encapsulado:
TUBE
Retención de Datos:
200(Min) Year
EEPROM - Serial-I²C - 256Kb (32K x 8) - 1MHz - 1.8V/2.5V/3.3V/5V - 8-Pin MSOP - Tube
Palabras clave de búsqueda:
24FC256IMS
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 600
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
100
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
100
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
100
$0.712
$71.200
300
$0.710
$213.000
500
$0.705
$352.500
1.000
$0.700
$700.000
2.500
$0.697
$1,742.500
5.000
$0.695
$3,475.000
7.500
$0.693
$5,197.500
10.000 +
$0.691
$6,910.000
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 03-Apr-2013 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices in orde
PDF PCN - 26-Jan-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG
PDF PCN - 09-Jun-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 30-Jan-2006 -
PDF PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 22-Jan-2004 - QUALIFY MTAI ASSEMBLY FOR LARGE PADDLES (82X94 MILS AND 84X105.6 MILS)
PDF PCN - 06-Nov-2003 -
PDF PCN - 04-Sep-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 26-Jun-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE
PDF PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices
PDF PCN - 17-Apr-2019 - RE-ISSUED FINAL NOTIFICATION - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE
PDF PCN - 03-Apr-2013 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET DOCUMENT REVISION
PDF PCN - 08-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K, 160K AND 250K WAFER TECHNOLOGIES
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 14-May-2010 - Microchip has released a new DeviceDoc for the 24AA256/24LC256/24FC256 Data Sheet of devices.
PDF PCN - 08-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K, 160K AND 250K WAFER TECHNOLOGIES
PDF PCN - 26-Nov-2013 - 24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 03-Jun-2004 -
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 22-Dec-2017 - RE-ISSUED INITIAL NOTICE QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY
PDF PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 150K AND 160K WAFER
PDF PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to
PDF PCN - 26-Nov-2013 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 25-Oct-2021 - DATA SHEET - 24AA256/24LC256/24FC256 256 KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION
PDF PCN - 20-Aug-2018 - UPDATED FIRST LINE MARKING CODES TABLE
PDF PCN - 23-May-2018 - ISSUED FINAL NOTIFICATION QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag
PDF PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 04-Sep-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS
PDF PCN - 10-Dec-2012 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET
PDF PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 27-May-2010 - CONVERSION OF 24LC256, 24FC256 AND 24AA256 PRODUCT FAMILIES TO 160K TECHNOLOGY
PDF PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 06-Mar-2006 -
PDF PCN - 29-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 22-Jan-2004 -
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 150K AND 160K WAFER
PDF PCN - 07-Aug-2019 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET CHANGE
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 26-Feb-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG
PDF PCN - 27-May-2010 - 24LC256, 24FC256 and 24AA256 serial EEPROMs will be moved from their current 150K (0.5 micron) fabri
PDF PCN - 23-Apr-2001 -
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 09-Jul-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 22-Dec-2017 - RE-ISSUED INITIAL NOTICE QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS
PDF PCN - 05-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY
PDF PCN - 10-Dec-2012 - 24AA256/24LC256/24FC256 DATA SHEET
PDF PCN - 13-Jul-2011 - DATA SHEET-24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 22-Jan-2004 -
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 10-Dec-2012 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices.
PDF PCN - 11-Nov-2004 -
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

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