help desk software
24FC512T-I/SM by microchip technology
Imagen de referencia - consulte las especificaciones del fabricante
FICHA TÉCNICA

24FC512T-I/SM

Microchip Technology

The 24FC512T-I/SM is a 512 Kbit (64K x 8) high-speed serial EEPROM with an I2C-compatible two-wire interface. .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
Atributo del producto
Valor del atributo Seleccionar atributo
Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
24FC512T-I/SM
RoHS:
Yes
HTS:
8542320051
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
2100
Tipo de encapsulado:
REEL
The 24FC512T-I/SM is a 512 Kbit Electrically Erasable PROM organized as 64K x 8-bit memory, designed for low-power and high-speed operation. It operates on a single supply voltage from 1.7V to 5.5V and supports a maximum clock frequency of 1 MHz. This device features a low standby current of 1 µA (maximum) and a 128-byte page write buffer with a maximum write time of 5 ms. With high endurance of over 1 million erase/write cycles and data retention exceeding 200 years, this EEPROM is ideal for reliable, non-volatile data storage in a wide range of industrial applications.
Palabras clave de búsqueda:
24FC512TISM
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 4.275
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
13 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$0.853
$213.250
500
$0.842
$421.000
2.100
$0.775
$1,627.500
4.200
$0.773
$3,246.600
6.300
$0.771
$4,857.300
8.400
$0.766
$6,434.400
10.500
$0.765
$8,032.500
16.800 +
$0.758
$12,734.400
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 20-Nov-2009 - The serial EEPROMs listed will be moved from their current 160K double layer metal (DLM), (0.4 micro
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING
PDF PCN - 22-Oct-2013 - PCN REVISED: REMOVED DEVICES FROM THE FINAL NOTIFICATION
PDF PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 06-Mar-2006 -
PDF PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an
PDF PCN - 26-Feb-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 20-Nov-2009 - CONVERSION OF 24XX512 PRODUCT FAMILIES TO 160K TLM
PDF PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 16-Dec-2009 - MICROCHIP HAS RELEASED A NEW DEVICEDOC
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and
PDF PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 07-Oct-2005 -
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 26-Jan-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG
PDF PCN - 04-Mar-2021 - QUALIFICATION OF 66.88K PROCESS TECHNOLOGY FOR SELECTED MICROCHIP PRODUCTS
PDF PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 29-Mar-2010 - Microchip has released a new DeviceDoc for the 24AA512/24LC512/24FC512 512K I2C Serial EEPROM Data S
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 29-Mar-2010 - DATA SHEET-24AA512/24LC512/24FC512 512K I2C SERIAL EEPROM DATA SHEET
PDF PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com
PDF PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 13-Jul-2006 - QUALIFICATION OF 14L TSSOP AT ATP
PDF PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 16-Dec-2009 - Microchip has released a new DeviceDoc for the 24AA512/24LC512/24FC512 512K I2C Serial EEPROM Data S
PDF PCN - 19-Feb-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS
PDF PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS
PDF PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 08-Nov-2010 - QUALIFICATION OF 8L SOIJ PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 22-Jan-2004 -
PDF PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 06-Nov-2003 -
PDF PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L
PDF PCN - 02-Nov-2007 - CHANGE IN BOM
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

© 2026 ECCO GROUP ECIA