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DSPIC33FJ128GP706-I/PT by microchip technology
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DSPIC33FJ128GP706-I/PT

Microchip Technology

MCU - 16-bit dsPIC - 128KB Flash - 16KB RAM - -40°C to +85°C - 3.3V - 64-Pin TQFP - Tray .. Ver descripción completa

Cumple con RoHS
TRAY embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Este producto puede requerir documentación adicional. El envío puede retrasarse de 1 a 2 días.
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Proveedor:
Microchip Technology
Nº de pieza:
DSPIC33FJ128GP706-I/PT
RoHS:
Yes
HTS:
8542310020
COO:
TH
ECCN:
3A991.a.2
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
160
Tipo de paquete:
TRAY
Operating Temperature:
-40 to 85 °C
Program Memory Size:
128 KB
ADC Resolution:
10/12 bit
Number of Programmable I/Os:
53
Program Memory Type:
Flash
RAM Size:
16 KB
The MICROCHIP TECH. part DSPIC33FJ128GP706-I/PT is a powerful 16-bit microcontroller unit (MCU) that is designed for applications requiring high-performance digital signal processing capabilities. It features 128KB of Flash memory and 16KB of RAM, providing ample storage for program code and data. With a wide operating temperature range of -40°C to +85°C, this MCU is suitable for use in harsh environments. It operates at a voltage of 3.3V and is housed in a 64-pin TQFP package. The tray packaging ensures easy handling and storage.
Palabras clave de búsqueda:
DSPIC33FJ128GP706IPT
EN STOCK: 260
Puede enviar inmediatamente
Cantidad mínima de pedido:
5
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
5
$7.39
$36.95
25
$7.04
$176.00
50
$6.95
$347.50
160
$6.83
$1,092.80
320
$6.75
$2,160.00
640
$6.73
$4,307.20
1.120 +
$6.71
$7,515.20
Suppliers Standard Package
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 27-Mar-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE
PDF PCN - 07-Jan-2013 - ERRATA - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 03-Aug-2010 - Mcrochip is announcing the qualification of the listed YGAGx products at an additional wafer fabrica
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 22-Jul-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 09-Jun-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 25-Jan-2012 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 25-Aug-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT
PDF PCN - 11-Nov-2004 -
PDF PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)
PDF PCN - 29-Jan-2010 - ERRATA-DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION
PDF PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 03-Jun-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 04-Mar-2011 - QUALIFICATION OF YGAB, YGAG, YGAE, YGAK, YGAP, AND UDAA MASKS WITHOUT POLYIMIDE PROCESS.
PDF PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 11-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 12-May-2008 - Modifications have been made to the 16-bit MPLAB C libraries for the self-programming routines_write
PDF PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in
PDF PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 25-Jan-2012 - DSPIC33FJXXXGPX06/X08/X10 FAMILY SILICON ERRATA & DATA SHEET CLARIFICATION ERRATA DOCUMENT REVISION
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 22-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

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