MCP1525T-I/TT by microchip technology
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MCP1525T-I/TT

Microchip Technology

Voltage Reference - Precision - Series - Fixed - 2.5V - 8mA - SOT-23-3 - 3-Pin. .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Proveedor:
Microchip Technology
Nº de pieza:
MCP1525T-I/TT
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
3000
Tipo de encapsulado:
REEL
Coeficiente de Temperatura Máximo:
50 ppm/°C
Montaje:
Surface Mount
Familia:
MCP1525
Corriente de Salida Máxima:
8(Typ) mA
Precisión inicial:
1 %
Tensión de entrada máxima:
7 V
Regulación de carga:
1.3 mV/ mA
Regulación de Línea:
350 uV/V
Dimensión:
2.9 x 1.3 x 0.95 mm
The MCP1525T-I/TT is a low power, high precision voltage reference in 3 pin SOT-23 package. This voltage reference is normally used in 3V to 5V systems where wide variations in supply voltage exists and need to minimize power dissipation. The MCP1525 use combination of an advanced CMOS circuit design and EEPROM trimming to provide an initial tolerance of 1% and temperature stability of 50ppm/°C. This device offers clear advantage over traditional zener techniques in terms of stability across time and temperature.
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MCP1525TITT
EN STOCK: 34.450
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Cantidad mínima de pedido:
500
Plazo de entrega de fábrica
4 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
500
$0.820
$410.000
1.000
$0.814
$814.000
3.000
$0.742
$2,226.000
6.000
$0.740
$4,440.000
9.000
$0.738
$6,642.000
12.000
$0.736
$8,832.000
15.000
$0.734
$11,010.000
27.000 +
$0.732
$19,764.000
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 12-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 3, 5 and 6L SOT-23 package products with SG-
PDF PCN - 19-Oct-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Mar-2007 -
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of the listed 6L SOT-23 package products with SG-8300GM mo
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 11-Nov-2004 -
PDF PCN - 08-Nov-2010 - QUALIFICATION OF THE 6L SOT-23 PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 12-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 19-Oct-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 120K WAFER TECHNOL
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 22-Jan-2004 -
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 30-Jan-2006 -
PDF PCN - 07-Mar-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF Product Change Notification

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