MCP1725-3302E/MC by microchip technology
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MCP1725-3302E/MC

Microchip Technology

LDO Regulator Pos 3.3V 0.5A Automotive 8-Pin DFN EP .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP1725-3302E/MC
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
150
Tipo de encapsulado:
TUBE
Voltaje de Dropout Máximo @ Corriente:
0.35@500mA V
Unión a Encapsulado:
N/A
Precisión:
±2 %
Regulación de Línea:
0.05(Typ) %/V
Unión a Ambiente:
52(Typ) °C/W
Dimensión:
2 x 3 x 0.95(Max) mm
Función:
LDO
Regulación de carga:
0.5(Typ) %
Familia:
MCP1725
The MICROCHIP TECH. MCP1725-3302E/MC is a low-dropout (LDO) regulator with a positive voltage output of 3.3V and a maximum current rating of 0.5A. Designed specifically for automotive applications, this regulator offers reliable and stable power supply to various electronic systems in a vehicle. The 8-Pin DFN EP package ensures compactness and easy integration into space-constrained designs.
Palabras clave de búsqueda:
MCP17253302EMC
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 900
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
150
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
150
Plazo de entrega de fábrica
13 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
150
$0.539
$80.850
600
$0.533
$319.800
1.050
$0.529
$555.450
2.550
$0.527
$1,343.850
5.100
$0.525
$2,677.500
7.500
$0.524
$3,930.000
10.050
$0.523
$5,256.150
15.000 +
$0.522
$7,830.000
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 15-May-2011 - QUALIFICATION OF GEAXX MASKS WITH THE CMP PROCESS
PDF PCN - 10-Jul-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 28-Feb-2009 - Qualification Of 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem Assembly
PDF PCN - 30-May-2011 - Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Lead Frame At Nseb (Utl)
PDF PCN - 28-Mar-2011 - Microchip is announcing the qualification of listed GEAxx masks with the CMP process in order to imp
PDF PCN - 17-Dec-2008 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 22-Feb-2011 - Microchip Is Announcing The Qualification Of 8L Dfn (2X3) Packages With Eftec-64T Leadframe At Nseb
PDF PCN - 24-Jun-2009 - Microchip Is Qualifying The 8L Dfn Package With Crm1076Dj Epoxy And G770Hcd Mold Compound At Unisem
PDF PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

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