MCP2122T-E/SN by microchip technology
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MCP2122T-E/SN

Microchip Technology

Infrared Encoder/Decoder - 115.2KBd - 8-Pin SOIC N - Tape&Reel .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP2122T-E/SN
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
3300
Tipo de encapsulado:
REEL
Tensión de alimentación de funcionamiento máxima:
5.5 V
Velocidad de datos máxima:
115.2 KBd
Dimensión:
4.9 x 3.9 x 1.25(Min) mm
Familia:
MCP2122
Tensión mínima de alimentación de funcionamiento:
1.8 V
Categoría:
Infrared Encoder/Decoder
Montaje:
Surface Mount
The MCP2122T-E/SN is an infrared encoder/decoder module designed for easy integration into various applications. It operates at a high baud rate of 115.2KBd and features an 8-pin SOIC N package. This module is supplied in Tape&Reel packaging, ensuring efficient handling and storage. With its reliable infrared encoding and decoding capabilities, the MCP2122T-E/SN is an excellent choice for projects requiring seamless wireless communication.
Palabras clave de búsqueda:
MCP2122TESN
EN STOCK: 4.950
Puede enviar inmediatamente
Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$0.974
$243.500
500
$0.965
$482.500
1.000
$0.955
$955.000
3.300
$0.780
$2,574.000
6.600
$0.779
$5,141.400
9.900
$0.777
$7,692.300
13.200
$0.775
$10,230.000
16.500 +
$0.773
$12,754.500
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF Product Change Notification

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