MCP23017T-E/SO by microchip technology
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FICHA TÉCNICA

MCP23017T-E/SO

Microchip Technology

I/O Expander - 16bit - 1.7MHz - I2C - 1.8 to 5.5 V - SOIC W - 28-Pin. .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Proveedor:
Microchip Technology
Nº de pieza:
MCP23017T-E/SO
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
1600
Tipo de encapsulado:
REEL
Velocidad de Interfaz:
1700 kHz
Tipo de Interfaz:
I²C
Dimensión:
17.9 x 7.5 x 2.05(Min) mm
Reset Manual:
Yes
Tensión de alimentación de funcionamiento máxima:
5.5 V
Modo de Interfaz del Bus I2C:
Standard Mode
Familia:
MCP23017
Salida de Interrupción:
Yes
The MCP23017/MCP23S17 (MCP23X17) device family provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications. The MCP23X17 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits (IODIRA/B). The data for each input or output is kept in the corresponding input or output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master.
Palabras clave de búsqueda:
MCP23017TESO
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 3.105
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Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
8 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$1.30
$325.00
500
$1.28
$640.00
1.600
$1.21
$1,936.00
3.200
$1.20
$3,840.00
6.400
$1.19
$7,616.00
8.000
$1.18
$9,440.00
11.200
$1.17
$13,104.00
16.000 +
$1.16
$18,560.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 01-Apr-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 28-Feb-2011 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 28-Jun-2010 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM
PDF PCN - 18-Jan-2011 - Microchip is announcing the qualification of different paddle sizes in 18L & 28L SOIC packages at MM
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 31-May-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF Product Change Notification

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