help desk software
MCP23S18-E/MJ by microchip technology
Imagen de referencia - consulte las especificaciones del fabricante
FICHA TÉCNICA

MCP23S18-E/MJ

Microchip Technology

16-Bit I/O Expander - SPI Interface - 10MHz - 5.5V - Automotive - 24-Pin QFN - Tube .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
Atributo del producto
Valor del atributo Seleccionar atributo
Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP23S18-E/MJ
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
91
Tipo de encapsulado:
TUBE
Velocidad de Interfaz:
10000 kHz
Tipo de Interfaz:
SPI
Salida de Interrupción:
Yes
Reset Manual:
Yes
Tensión de alimentación de funcionamiento máxima:
5.5 V
Dimensión:
4 x 4 x 0.83 mm
Modo de Interfaz del Bus I2C:
N/R
Familia:
MCP23S18
The MCP23S18-E/MJ is a 16-bit I/O expander that utilizes a SPI interface, making it ideal for applications requiring additional I/O pins. This automotive-grade device supports a 10MHz clock frequency and operates within a voltage range of 5.5V. With its 24-pin QFN package and tube packaging, it offers convenient integration and storage. Expand your connectivity options with the MCP23S18-E/MJ and optimize your automotive electronics design.
Palabras clave de búsqueda:
MCP23S18EMJ
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 655
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
91
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
91
Plazo de entrega de fábrica
14 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
91
$1.31
$119.21
182
$1.30
$236.60
273
$1.28
$349.44
546
$1.27
$693.42
1.001
$1.25
$1,251.25
2.548
$1.24
$3,159.52
5.005
$1.23
$6,156.15
7.553 +
$1.22
$9,214.66
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 18-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 31-Oct-2014 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 18-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 02-Nov-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 02-Nov-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND A194-FH LEAD FRAME MATERIAL FOR SELECTED PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 04-May-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF Product Change Notification

© 2026 ECCO GROUP ECIA