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MCP2510-I/ST by microchip technology
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FICHA TÉCNICA

MCP2510-I/ST

Microchip Technology

CanBus Controller - 5Mbps - Sleep/Standby - 3.3V/5V - 20-Pin TSSOP - Tube .. Ver descripción completa

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TUBE embalaje
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP2510-I/ST
RoHS:
Yes
HTS:
8542390090
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
74
Tipo de paquete:
TUBE
Familia:
MCP2510
Categoría:
Controller
Dimensión:
6.5 x 4.4 x 1 mm
The MCP2510-I/ST by Microchip Technology is a CanBus Controller designed to facilitate robust and reliable communication between microcontrollers and CAN networks. With a high-speed data rate of up to 5Mbps, this controller enables fast and efficient data transfer. It features sleep and standby modes, allowing for power-saving operation when idle. The MCP2510-I/ST can operate at both 3.3V and 5V, making it adaptable to a wide range of applications. This controller is housed in a compact and durable 20-pin TSSOP package, supplied in a convenient tube for easy handling and storage.
Palabras clave de búsqueda:
MCP2510IST
EN STOCK: 366
Puede enviar inmediatamente
Cantidad mínima de pedido:
5
Plazo de entrega de fábrica
19 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
5
$4.46
$22.30
74
$4.12
$304.88
148
$3.97
$587.56
296
$3.87
$1,145.52
518
$3.74
$1,937.32
1.036
$3.73
$3,864.28
2.516
$3.70
$9,309.20
5.032 +
$3.66
$18,417.12
Embalaje estándar del proveedor
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 19-Mar-2007 - QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i
PDF PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 17-Jul-2014 - QUALIFICATION OF CDA194 LEAD-FRAME AT ANAP FOR 20L TSSOP 4.4MM WIDTH PACKAGE
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro
PDF PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS
PDF PCN - 12-Jan-2006 -
PDF PCN - 07-Oct-2005 - 20L SSOP 207'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 19-Mar-2007 -
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 07-Oct-2005 - 18L SOIC 300'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)
PDF PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP
PDF PCN - 07-Oct-2005 -
PDF PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB
PDF PCN - 17-Jul-2014 - QUALIFICATION OF CDA194 LEAD-FRAME AT ANAP FOR 20L TSSOP 4.4MM WIDTH PACKAGE
PDF PCN - 19-Dec-2014 - QUALIFICATION OF CDA194 LEAD-FRAME AT ANAP FOR 20L TSSOP 4.4MM WIDTH PACKAGE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS
PDF PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products
PDF PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB
PDF PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS
PDF PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS
PDF PCN - 11-Nov-2004 -
PDF PCN - 12-Jan-2006 - Product Change Notice
PDF PCN - 19-Mar-2007 - Product Change Notice
PDF PCN - 01-Jan-2006 - 20L Ssop 207'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 07-Oct-2005 - Product Change Notice
PDF PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).
PDF PCN - 11-Nov-2004 - Product Change Notice

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