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MCP6004T-E/ST by microchip technology
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FICHA TÉCNICA

MCP6004T-E/ST

Microchip Technology

Quad Op Amp - Low Power - 1MHz GBP - 1.8 to 6.0 VDC - Rail to Rail I/O - 14-lead TSSOP - -40°C to +125°C

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP6004T-E/ST
RoHS:
Yes
HTS:
8542330001
COO:
MY
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
2500
Tipo de paquete:
REEL
Corriente de Offset de Entrada Máxima:
0.000001(Typ)@5.5V uA
Familia:
MCP6004
Tipo de fabricante:
Low Power Amplifier
Voltaje de Offset de Entrada Máximo:
4.5@5.5V mV
Tensión de alimentación dual máxima:
N/R
Corriente de Polarización de Entrada Máxima:
N/A
Dimensión:
5 x 4.4 x 1 mm
Tensión de alimentación de funcionamiento máxima:
6 V
The MCP6004T-E/ST is a low power quad operational amplifier, designed for general-purpose applications. Extended temp. range -40°C-125°C. Package type is a Plastic TSSOP, (4.4 mm body), 14-lead.
Palabras clave de búsqueda:
MCP6004TEST
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Cantidad mínima de pedido:
500
Plazo de entrega de fábrica
4 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
500
$0.583
$291.500
1.000
$0.578
$578.000
2.500
$0.576
$1,440.000
5.000
$0.574
$2,870.000
7.500
$0.573
$4,297.500
10.000
$0.571
$5,710.000
15.000
$0.570
$8,550.000
25.000 +
$0.568
$14,200.000
Embalaje estándar del proveedor
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Nov-2009 - Microchip has released a new DeviceDoc for the MCP6001/R/U/2/4, 1 MHz, Low-Power Op Amp of devices.
PDF PCN - 13-Jul-2006 - Product Change Notice
PDF PCN - 06-Sep-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa
PDF PCN - 12-Apr-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 22-Jan-2004 - Qualify Unisem For Assembly Of 14L Tssop Package
PDF PCN - 31-Jul-2007 - Qualification Of 14L Tssop Package Assembly At Vgt (Vigilant, Thailand)
PDF PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 25-Oct-2004 - Change From Snpb Plating To Matte Tin Plating (Industry-Standard Pure Sn) Of The Device Leads
PDF PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 20-Feb-2007 - Product Change Notice
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 18-Aug-2012 - Qualification Of 14L Tssop Package At Mmt (Alph) Assembly Site
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Apr-2007 - Product Change Notice
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 19-Mar-2007 - Product Change Notice
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF Product Change Notification

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