MCP6022-E/P by microchip technology
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FICHA TÉCNICA

MCP6022-E/P

Microchip Technology

Op Amp Dual GP R-R I/O 5.5V Automotive 8-Pin PDIP Tube .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
MCP6022-E/P
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
60
Tipo de encapsulado:
TUBE
Dimensión:
9.27 x 6.35 x 3.3 mm
The MCP6022-E/P is a high-performance dual operational amplifier designed for automotive applications, offering a wide range of functionality. This op amp supports rail-to-rail input/output operation and operates on a 5.5V power supply, making it suitable for automotive systems that require precision signal amplification and processing. The compact 8-pin PDIP package allows for easy integration onto circuit boards. With outstanding accuracy, low noise, and excellent stability over temperature, the MCP6022-E/P is an ideal choice for automotive electronics in demanding environments.
Palabras clave de búsqueda:
MCP6022EP
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 960
Puede enviar inmediatamente
Cantidad mínima de pedido:
60
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
60
Plazo de entrega de fábrica
25 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
60
$1.49
$89.40
300
$1.40
$420.00
540
$1.39
$750.60
1.020
$1.38
$1,407.60
2.520
$1.37
$3,452.40
5.040
$1.36
$6,854.40
7.500
$1.35
$10,125.00
10.020 +
$1.34
$13,426.80
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND
PDF PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo
PDF PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA
PDF PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (
PDF PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 22-Jan-2004 - QUALIFY UNISEM FOR ASSEMBLY OF 8L PDIP PACKAGES
PDF PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD
PDF PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De
PDF PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150
PDF PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY
PDF Product Change Notification

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