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MCP6022T-E/SN by microchip technology
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MCP6022T-E/SN

Microchip Technology

Op Amp Dual GP R-R I/O 5.5V Automotive 8-Pin SOIC N T/R .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Proveedor:
Microchip Technology
Nº de pieza:
MCP6022T-E/SN
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
3300
Tipo de encapsulado:
REEL
Corriente de Offset de Entrada Máxima:
0.000001(Typ)@5.5V uA
Tensión de alimentación de funcionamiento máxima:
5.5 V
Tipo de fabricante:
General Purpose Amplifier
Tensión de alimentación dual máxima:
N/R
Voltaje de Offset de Entrada Máximo:
0.25@5V mV
Corriente de Polarización de Entrada Máxima:
0.005@5.5V@125C uA
Dimensión:
4.9 x 3.9 x 1.25(Min) mm
Familia:
MCP6022
The MICROCHIP TECH. MCP6022T-E/SN is a high-performance, dual general-purpose operational amplifier (Op Amp) designed for automotive applications. With a wide input and output range of 5.5V, this Op Amp is capable of operating in harsh automotive environments. It is housed in an 8-pin SOIC package and is supplied on tape and reel for easy handling and integration into manufacturing processes. With its strong performance and automotive-grade reliability, the MCP6022T-E/SN is an excellent choice for a variety of automotive applications requiring precision amplification.
Palabras clave de búsqueda:
MCP6022TESN
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 2.275
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Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$1.37
$342.50
500
$1.34
$670.00
1.000
$1.33
$1,330.00
3.300
$1.32
$4,356.00
6.600
$1.31
$8,646.00
9.900
$1.30
$12,870.00
13.200 +
$1.29
$17,028.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 26-May-2005 - Product Change Notice
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 28-Jun-2005 - Product Change Notice
PDF PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 30-Jan-2006 - Product Change Notice
PDF PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 23-Dec-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF Product Change Notification

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