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PIC16LF877-04I/PT by microchip technology
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FICHA TÉCNICA

PIC16LF877-04I/PT

Microchip Technology

MCU 8-bit PIC16 PIC RISC 14.3KB Flash 5V 44-Pin TQFP .. Ver descripción completa

Cumple con RoHS
TRAY embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Garantía del certificado de conformidad
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
PIC16LF877-04I/PT
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
EAR99
Empaque estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precio y disponibilidad.
160
Tipo de encapsulado:
TRAY
Número de I/Os Programables:
33
Tipo de Memoria de Programa:
Flash
Tamaño de la memoria de programa:
14.3 KB
Temperatura de Funcionamiento:
-40 to 85 °C
The MICROCHIP TECH. part PIC16LF877-04I/PT is a powerful 8-bit Microcontroller Unit (MCU) from the PIC16 family. It features a low-power consumption design and operates at 5V. With a RISC architecture, this MCU delivers high performance while consuming minimal power. It offers 14.3KB of Flash memory for program storage and comes in a compact 44-Pin TQFP package. This versatile MCU is suitable for a wide range of applications and provides the flexibility and reliability required for various embedded systems.
Palabras clave de búsqueda:
PIC16LF87704IPT
EN STOCK: 230
Envío today, Introduzca el valor de la configuración.
MOQ para Cantidad en Stock:
5
MOQ para cantidad agotada:
40
Plazo de entrega de fábrica
19 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
5
$10.98
$54.90
10
$10.96
$109.60
25
$10.86
$271.50
40
$10.83
$433.20
80
$10.75
$860.00
120
$10.72
$1,286.40
160 +
$10.70
$1,712.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 01-Apr-2006 - QUALIFICATON OF 44L PLCC AT NEW ASSEMBLY SITE: AIC
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 09-Feb-2006 - Product Change Notice
PDF PCN - 01-Dec-2005 - Product Change Notice
PDF PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND
PDF PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at
PDF PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY
PDF PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa
PDF PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

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