PIC18F242-I/SO by microchip technology
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FICHA TÉCNICA

PIC18F242-I/SO

Microchip Technology

MCU 8 Bit - Flash - PIC18 Family PIC18F24xx Series Microcontrollers - 40 MHz - 16 KB - 768 Byte - 28 Pins. .. Ver descripción completa

Cumple con RoHS
TUBE embalaje
Accesorios
Accesorios
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Productos Encontrados: 0
Proveedor:
Microchip Technology
Nº de pieza:
PIC18F242-I/SO
RoHS:
Yes
HTS:
8542310015
COO:
TH
ECCN:
3A991.a.2
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
27
Tipo de encapsulado:
TUBE
Número de I/Os Programables:
23
Tipo de Memoria de Programa:
Flash
Temperatura de Funcionamiento:
-40 to 85 °C
Tamaño de la memoria de programa:
16 KB
The PIC18F242-I/SO is a high-performance PIC18 family 8-bit powerful (100 nanosecond instruction execution) yet easy-to-program CMOS flash based Microcontroller packs powerful PIC®(RISC) architecture with up to 10 MIPS of processing power. This product offer all of the advantages of the well recognized high-performance x16 architecture with standardized features including 16kB of addressable program memory size, 768bytes of data memory size, 25 general-purpose I/O pins, two comparators and 5-channel 10-bit analog-to-digital (A/D) converter. This device operates at a maximum frequency of 40MHz wide operating voltage of 2 to 5.5V.
Palabras clave de búsqueda:
PIC18F242ISO
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 2.187
Puede enviar inmediatamente
Cantidad mínima de pedido:
27
Esta plantilla de mensaje se utiliza para notificar a un afiliado que un pedido determinado fue pagado. El pedido obtiene el estado Pagado cuando se cobra el importe.:
27
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
27
$6.70
$180.90
54
$6.64
$358.56
108
$6.59
$711.72
270
$6.56
$1,771.20
513
$6.54
$3,355.02
1.026
$6.52
$6,689.52
2.511 +
$6.51
$16,346.61
Embalaje estándar del proveedor
Cambios del producto
PDF PCN - 15-Dec-2011 - QUALIFICATION OF 18 & 28L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 12-Mar-2003 - FIRMWARE CHANGE
PDF PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA
PDF PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M
PDF PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED
PDF PCN - 19-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 09-Sep-2003 - Product Change Notice
PDF PCN - 06-Apr-2001 - Convert To Sumitomo G-600 Mold Compound In 28L Soic Package At Alph Thailand Assembly Site
PDF PCN - 15-Jul-2002 - MPLAB V5.70 RELEASED
PDF PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON
PDF PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SOIC PACKAGE WITH PALLADIUM COATED COPPER
PDF PCN - 05-Sep-2003 - Product Change Notice
PDF PCN - 06-Mar-2006 - Product Change Notice
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED
PDF PCN - 17-Jun-2002 - MPLAB V5.62 RELEASED
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF Product Change Notification

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