HSS-B20-0635H-01 is a compact aluminum heat sink designed for efficient thermal dissipation in electronic applications. It features a fin height of 9.53 mm, thermal resistance of 27.78 °C/W at natural convection with 75°C temperature differential, and a maximum power dissipation of 2.70 W under natural convection conditions. The heat sink is constructed from AL1050 aluminum with a black anodized finish, 1.2 mm thickness, and includes a brass solder pin with tin plating for secure PCB mounting and a round hole for component attachment. With thermal resistance values of 9.51 °C/W at 200 LFM and 6.84 °C/W at 400 LFM airflow, this heat sink is well-suited for applications requiring moderate thermal management in compact form factors, such as power regulators, LED drivers, and small signal amplifiers.