HSS-B20-NP-10 is a heat sink designed for the TD-220 package with no solder pin configuration, utilizing a slide-in style for easy component attachment. The heat sink is constructed from AL5052 aluminum with a black anodized finish and 0.8 mm thickness, providing robust thermal management. It delivers a thermal resistance of 25.92°C/W at 75°C temperature differential under natural convection, 30.86°C/W at 1 W natural convection, 7.24°C/W at 1 W with 200 LFM airflow, and 8.25°C/W at 1 W with 400 LFM airflow, with a maximum power dissipation of 2.89 W at 75°C temperature differential. The unit weighs 1.7 g and is RoHS compliant, making it suitable for applications requiring efficient passive thermal dissipation in compact electronic assemblies.