The 103908-2 is a vertical through-hole header component designed for the AMPMODU MTE interconnect system, featuring swaged tall posts with 30 µ" gold plating to ensure reliable electrical contact and corrosion resistance. This header is configured for single-row, wire-to-board applications and supports position counts from 2 to 25, with a 100 mil centerline spacing. The product accommodates wire gauges from #22 to #30 AWG for IDC configurations and operates reliably across a temperature range of -65°C to +105°C, making it suitable for demanding industrial environments. The swaged post design provides enhanced retention in printed circuit boards, while the polarization and latching features ensure proper mating alignment. Common applications include computers, copiers, commercial printers, appliances, medical equipment, and automotive control systems where robust wire-to-board connectivity is required.