104074-6 is a 30-position shrouded header designed for board-to-board vertical interconnection within the AMPMODU Interconnection System. It features a 0.050 x 0.100 inch (1.27 x 2.54 mm) centerline spacing and is constructed with a glass-filled thermoplastic housing rated 94V-0 in black. The contacts are made of copper alloy with duplex plating: 0.000030 inch (0.00076 mm) gold in the mating area and 0.000150 inch (0.00381 mm) tin on solder posts, with an entire contact underplated 0.000050 inch (0.00127 mm) nickel. This header is commonly used in PC/104 and embedded computing applications where reliable board-to-board connections and compact spacing are required.