1-2199298-9 is a 28-position DIP socket with dual leaf contacts designed for reliable interconnection between integrated circuits and printed circuit boards. The socket features dual leaf contacts that enlarge the contact area and ensure low, constant contact resistance, combined with a true closed bottom design that prevents solder and flux wicking. It is manufactured from 30% glass-filled PBT thermoplastic with phosphorous bronze contacts plated in tin, and is lead-free (RoHS compliant). The socket accommodates IC pins from 0.008" to 0.012" diameter and provides a maximum insertion force of 300 grams with a minimum withdrawal force of 20 grams, ensuring secure yet removable IC placement. With a centerline spacing of 7.62 mm (300 CL) and through-hole solder termination, this socket is ideal for applications requiring easy component testing, upgrade, and field replacement in industrial controls, intelligent buildings, medical devices, and military embedded systems.