The 1-487545-4 is a double-row, vertical surface-mount receptacle housing designed for the AMPMODU System 50 board-to-board interconnection system. This latch-style receptacle housing features a 7-position configuration with contact spacing of 0.050 x 0.100 inches (1.27 x 2.54 mm) centerline, providing high-density interconnection capabilities. The housing is constructed from glass-filled thermoplastic material with a 94V-0 rating and includes a simple, low insertion-force holddown mechanism that provides both processing retention and long-term strain relief for solder joints. The receptacle accepts 0.015 inch square posts ranging from 0.125 to 0.350 inches in length, and the contacts are copper alloy with duplex plating of 0.000030 inches gold in the mating area and 0.000150 inches tin on the solder tail, underplated with 0.000050 inches nickel. This component is ideal for applications requiring reliable board-to-board connections in compact, high-density electronic assemblies.