1-5316562-1 is a fine-pitch SMT stacking connector designed for parallel board-to-board applications with 0.6mm contact pitch and 7H (7mm) stacking height. This 140-position connector features copper alloy contacts with duplex gold plating (0.00020 min. gold on contact area, 0.00005 min. gold on solder area) and nickel underplating (0.00130 min.), housed in high-temperature thermoplastic (94V-0 rated) with integrated ground plates. The connector is rated for 50 VAC voltage, 0.5 ampere current, with overall contact resistance less than 30 milliohms and dielectric withstanding voltage of 0.2 kVAC, operating reliably across -40°C to +85°C. This connector is ideal for high-density interconnect applications in telecommunications, computing, and industrial equipment where space constraints and reliable signal integrity are critical requirements.