2118731-2 is a two-piece board level shielding (BLS) cover component designed to provide electromagnetic interference (EMI) suppression and isolation of board-level components in compact electronic devices. The cover features a material thickness of 0.15 mm with dimensions of 51.30 mm length × 38.60 mm width × 2.00 mm height, constructed from stainless steel, galvanized steel, pre-plated cold rolled steel (CRS), or aluminum materials. Key technical characteristics include a minimum inner bending radius of 0.10 mm, a pitch of dimples of 3.0 mm minimum, and co-planarity specifications that are size-dependent. This shielding solution is commonly used in mobile phones, tablets, routers, wireless speakers, wearables, IoT devices, and other applications requiring board-level EMI suppression without impacting system speed or performance.