2-1445091-3 is a single-row vertical through-hole header connector from TE Connectivity's Micro MATE-N-LOK 3mm connector system. This 3-position header features 15µ gold contact plating and includes SMT hold-down and metal hold-down retention features for secure board mounting. The connector operates on a 3mm (0.118") centerline spacing and supports current ratings up to 5 Amps maximum per line. It is designed for wire-to-board connections and is compatible with infrared (IR) reflow soldering processes. Common applications include wire-to-wire and wire-to-board interconnections in various electronic assemblies.