440129-8 is a High Performance Interconnect (HPI) wire-to-board connector housing designed for signal and low-power routing applications. This 2.0mm centerline pitch housing supports 24–30 AWG wire gauges and accommodates 2 to 16 positions, with dimensions of 4.7 mm length (plus 2.00 mm per pin increase), 4.50 mm height, and 6.90 mm width. The connector operates over a temperature range of -25°C to +85°C and is rated for 3.0 A maximum current and 250 V maximum voltage (AC/DC), belonging to Spec Group G. The housing is compatible with multiple header types including DIP and SMT vertical/right-angle configurations, enabling flexible PCB mounting for business equipment, consumer devices, industrial, and automotive applications.