487544-9 is a plain receptacle housing for the AMPMODU System 50 interconnection system, designed for high-density board-to-board connections. This 12-position receptacle features contacts spaced on 0.050 x 0.100 inch (1.27 x 2.54 mm) centers, providing compact interconnect solutions for space-constrained applications. The housing is constructed from glass-filled thermoplastic rated 94V-0, with copper alloy contacts duplex plated with 0.000030 inch gold in the mating area and 0.000150 inch tin on the solder tail, underplated with 0.000050 inch nickel for durability. The receptacle accepts 0.015 inch square posts ranging from 0.125 to 0.350 inches in length and includes stand-offs for removal of solder flux. This connector is ideal for applications requiring reliable, high-density board-to-board interconnections in telecommunications, computing, and industrial equipment where space efficiency and signal integrity are critical.