5-103974-4 is an AMPMODU Mod IV receptacle assembly featuring a single-row, outrigger design with 0.100 x 0.100 inch (2.54 x 2.54 mm) centerline spacing and end-to-end stackable capability. The assembly utilizes a glass-filled thermoplastic housing rated 94V-0 with dual entry and low-profile configuration, supporting 0.200 inch (5.08 mm) tine spacing. Contact plating options include Plating A (duplex 0.000030 inch gold on contact area with 0.000150-0.000300 inch matte tin on solder area and 0.000050 inch nickel), Plating B (duplex 0.000010 inch gold with similar tin and nickel coverage), and Plating C (matte tin with nickel). This receptacle assembly is designed for printed circuit board applications with recommended hole layout for 0.055 inch minimum thick PC boards, making it suitable for interconnection systems requiring reliable, stackable connector solutions in compact form factors.