5-104118-1 is a single row, vertical unshrouded header connector designed for board-to-board interconnection applications. It features 50 positions with a 0.100 inch (2.54 mm) centerline spacing and a 0.050 inch (1.27 mm) typical pitch between contacts. The housing is constructed from glass-filled thermoplastic rated 94V-0, and the copper alloy contacts are duplex plated with 0.000030 inch (0.00076 mm) gold in the mating area and 0.000150 inch (0.00381 mm) tin on solder posts, with the entire contact underplated 0.000050 inch (0.00127 mm) nickel. This connector is part of the AMPMODU Interconnection System and is RoHS compliant. The robust contact plating and design provide superior electrical performance and excellent solderability for reliable board-to-board connections in electronic assemblies.