5223002-1 is a Z-PACK Futurebus+ board-to-board header connector designed for high-density interconnections on printed circuit boards. It features 30 signal positions arranged in 5 rows with a 2 mm centerline pitch and vertical PCB mounting orientation using compliant press-fit pins. The connector utilizes gold-plated contact mating areas (0.76 µm thickness) for reliable signal transmission, with a maximum contact current rating of 3 A and dielectric withstanding voltage of 1000 VAC. The housing is constructed from liquid crystal polymer (LCP) with natural color, and the connector includes polarization-based mating alignment with PCB mount retention. This connector is ideal for applications requiring robust board-to-board connections in industrial and telecommunications equipment, offering EU RoHS and ELV compliance for environmentally conscious designs.